身份验证
借助艾迈斯欧司朗的3D人脸识别和生物识别硬件和软件，可以轻松地设计人脸解锁等3D视觉功能和应用，并应用于您的产品。这些先进的技术可以提供更高的安全性和用户体验，为您的产品增添更多的价值。
安全便捷的生物特征识别和身份验证技术
成为您解锁3D人脸识别技术的钥匙
身份识别的核心技术也许您早已掌握。如今，个人身份验证在许多访问服务的过程中发挥着至关重要的作用，比如使用移动电子产品。未来，许多系统可能会依赖生物特征来识别和授权用户。艾迈斯欧司朗可提供帮助，确保这些系统高度可靠安全，从而尽可能确保重要事物安全性。
生物特征识别身份验证技术会识别人类独特的特征，包括脸部特征、虹膜图案或手掌纹路。生物识别技术实现了高度的安全行和便捷性，使用时无需管理复杂的密码。
艾迈斯欧司朗为生物特征识别系统提供独特的红外LED、垂直腔体表面发射激光和图像传感器。这些系统用于照亮目标区域，使传感器能够检测高质量的图像，并确保实现可靠的身份识别和验证功能。
艾迈斯欧司朗与线上快速身份验证联盟(FIDO)及其他合作伙伴开展了密切合作。这为我们进行互动测试、3D人脸识别身份验证器测试和生物识别元器件认证提供了保障。我们的目标是帮助客户以尽可能少的工作量在将身份验证功能集成到其产品和解决方案中，帮助客户更轻松、更快速地达到更高的安全标准。
两步注册和验证
3D人脸识别技术使用用户的脸部深度图信息。脸部深度图是在三维空间内绘制的数千个坐标点的集合，以用户正前方的一个视点为基准，描绘用户的脸部轮廓。这个深度图可与用户的脸部参考深度图比较，以验证用户身份。
Featured product families
OSLON® P1616 for mobile & wearables applications
The OSLON® P1616 Products are the smallest high power infrared LEDs in the product portfolio of ams OSRAM. With a package size of only 1.6 x 1.6 mm² and a best in class intensity the devices are the industry‘s smallest high power (near) infrared devices adressing different applications. IR Vision The infrared high power emitter devices are specially designed for IR illumination applications, such as 2D face recognition, eye tracking or security applications. Due to the low height, the products are the perfect fit for all space critical applications, nevertheless they captivate through an high optical output, efficiency and reliablity. Near Infrared Spectroscopy The OSLON® P1616 family also enables near infrared spectroscopy.A three times higher optical output power and a much smaller form factor paves the way for NIR Spectroscopy in space critical designs.
SYNIOS® P2720 for mobile & wearables applications
SYNIOS® P 2720 is a powerful and reliable product family that excels through its high brightness, low thermal resistance and thermal stability. Featuring different chip size classes and colors with one common footprint, the SYNIOS® P 2720 family also shines with high flexibility and full scalability. Another great advantage of the SYNIOS® P 2720 is its exceptional temperature cycle stability. The lead frame part is optimized for the thermal expansion coefficient of the circuit board, thus securing very stable soldered joints.