国際イメージセンサワークショップ（IISW）2021

Join our speeches about 3D Direct Time-of-Flight sensor technology and other image sensor innovations at ISSW

The IISW 2021 virtual workshop presents latest innovations in the area of solid-state image sensors and now in its 35th year, it is intended for image sensor technologists.

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1st Speaking Slot on Monday, September 20th
 

Session 03 Time-of-Flight: 4:48pm CEST

Presentation title: A reconfigurable QVGA/Q3VGA direct Time-of-Flight 3D imaging system with on-chip depth-map computation in 45/40nm 3D-stacked BSI SPAD CMOS

Abstract: We present a complete 3D dToF sensing system consisting of a RX camera- and TX laser-modules intended as a highly flexible development platform for next generation ams OSRAM high-performance, low power 3D-dToF imaging products supporting applications including 3D environment and object scanning, camera image enhancement, and camera autofocus assistance in dark conditions. The dToF sensor features 320x240-SPADs array organized into 80x60 macropixels. Each macropixel hosts 4x4 SPADs with related front-end and 16:1 compression tree logic, an ultra-low DNL 32-bin TDC with programmable resolution between 200-300ps and a time window gating logic used to scan over 8/16 consecutive time intervals. We will provide a system architecture overview and functional characterization results.

Speaker: David Stoppa
Head of System Definition and Validation at ams OSRAM

David Stoppa received the Laurea degree in Electronics Engineering from Politecnico of Milan, Italy, in 1998, and the Ph.D. degree in Microelectronics from the University of Trento, Italy, in 2002. In 2017 he joined ams OSRAM where he is now leading the System Definition and Validation team supporting the development of ams OSRAM 3D imaging systems products.

2nd Speaking Slot on Tuesday, September 21st

Session 05 Flash Papers - Session 1: 4:00pm (CEST)

Presentation title: Two-photon absorption in CMOS image sensors

Abstract: This paper characterizes the behavior of a 2.7 μm CMOS image sensor with respect to two-photon absorption (TPA). TPA can occur when two photons, with an energy lower than the bandgap energy of silicon, interact with the same electron within a short time window. This can be achieved with a tightly focused pulsed laser beam. If the combination of CMOS image sensors and TPA is feasible, thanks to ever reducing CMOS image sensor (CIS) read noise and increasing intensity of compact pulsed laser sources, the usable spectrum range of CMOS image sensors could be increased significantly which could lead to multiple light detection applications.

Speaker: Daan Blommaert
PhD student from KU-Leuven

Daan Blommaert is a PhD student at KU Leuven university in Belgium. He obtained his Master of Science in electronics at KU Leuven university in 2020 and continued studying for a PhD to research the two-photon absorption effect in CMOS image sensors. 

Mentor: Stefano Guerrieri
Engineering Fellow at ams OSRAM

Stefano Guerrieri received his M.Sc. degree in Solid State Physics from the University of L’Aquila, Italy, in 1999. From 2000 to 2004, he worked in Applied Materials as System Expert. As of September 2019, Stefano works at ams OSRAM as Engineering Fellow and his main activities are focused on technology innovation for sensors and image sensors. Stefano has authored or co-authored several patents and more than 30 publications.

3rd Speaking Slot on Wednesday, September 22nd
 

Session 07 Flash Paper Breakout Rooms - Session 2: 4:00pm-5:30pm CEST

Presentation title: Depth precision in dToF sensors for AR applications

Abstract: This contribution analyzes depth precision in a SPAD-based dToF sensor. Quadratic peak interpolation technique is utilized to obtain millimetric distance resolutions. The main contributions of this paper include analytical modeling and Monte Carlo simulations of the 1σ-precision based on the above technique. Further details on the simulation as well as experimental validation to support the aforementioned analysis will also be presented.

Speaker: Preethi Padmanabhan
3D Imaging Systems Architect at ams OSRAM

Preethi Padmanabhan received her MSc degree (cum laude and Honors) in Electrical Engineering from TU Delft, Netherlands, in August 2016 and PhD degree in Microsystems and Microelectronics from EPFL, Switzerland, in January 2021. She is currently working as a 3D Imaging Systems Architect at ams OSRAM. Her current interests include design and development of 3D imaging systems.

4th Speaking Slot on Thursday, September 23rd

Session 08 Regular Papers 3:30pm CEST

Presentation title: A 40000fps global shutter image sensor with 26.7ns 12-bit row readout time

Abstract: In this paper we present a global shutter image sensor with ultra-high-speed readout of 40000fps for scientific applications. Firstly, we include a description of the architecture which allows the high speed performance based on our novel ramp ADC. Secondly, we present techniques to further increase the speed for next generation high-speed sensors.

Speaker: Adi Xhakoni
Principal Engineer and System Architect at ams OSRAM

Adi Xhakoni received his Master's degree in Electronics Engineering from the Politecnico di Milano University, Italy in 2009. From 2010 until 2015 he was with the Department of Electrical Engineering at the KU Leuven University in Belgium where he performed research in the field of 3D-stacked imagers. After receiving his PhD in 2015, he joined Cmosis/ams. He is now principal engineer and system architect at ams OSRAM. He has co-authored several journal and conference papers, a book chapter, and 10 patent applications. 

> More details on the full program

We look forward to your registration.