OSRAM OSLON™ Black Flat X, KW4 HPL631.TK

Not for new design
×
Not for new design

品目

OSLON Black Flat S is able to meet a wide range of requirements. The SMT device is very stable, durable and can be used with standard processes. A new solder pad layout allows for high reliability and improved thermal management. The compact chips not only deliver high light output, they are also individually addressable with an ensured chip-to-chip contrast which makes this LED an ideal solution for Adaptive Driving Beam (ADB).
データシート
KW4 HPL631.TK
英語
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中国語（簡体字）
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選択と注文
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詳細

パラメーター

発光色
White
電力
13.0 W
Ultra High
輝度
ΦV 典型
1880 lm
IV 典型
609 cd
ΦE 典型
5860 mW
IE 典型
1900 mW/sr
ビーム角
∢ 典型
120 °
動作温度
Top 最小
-40 °C
Top 最大
135 °C
寸法
l 典型
7.59 mm
w 典型
3.75 mm
h 典型
0.5 mm
Device qualification
AEC-Q102

アプリケーション分野

自動車とモビリティ Headlights

注文情報

製品タイプ 品目 注文コード 在庫状況
KW4 HPL631.TK-BCBH-4L05M0-AGAE ΦV = 1640 ... 2040 lm (IF = 1000 mA) Q65113A1248 新設計は予定されていません
KW4 HPL631.TK-BCBJ-4L07M0-AGAE ΦV = 1640 ... 2115 lm (IF = 1000 mA) Q65113A4586 新設計は予定されていません
KW4 HPL631.TK-BDBJ-6L07M0-AGAE ΦV = 1700 ... 2115 lm (IF = 1000 mA) Q65113A1296 新設計は予定されていません

ダウンロード

データシート
KW4 HPL631.TK · Datasheet · PDF · en_US

アプリケーションノート
OSLON™ Black Flat X Family · Product related · PDF · en_US
Customer complaint management — Details on return shipments for failure analysis request (FAR) · General information · PDF · en_US
Details on photobiological safety of LED light sources · General information · PDF · en_US
Preventing LED failures caused by corrosive materials · General information · PDF · en_US
Importing rayfiles and ray-measurement files of LEDs · General information · PDF · en_US
Chemical compatibility of LEDs · General information · PDF · en_US
欧司朗光电半导体有限公司 LED 的测量、 · General information · PDF · en_US
Fundamentals of LED handling · Handling recommendations · PDF · en_US
ESD protection while handling LEDs · Handling recommendations · PDF · en_US
Handling of silicon resin LEDs · Handling recommendations · PDF · en_US
Dry pack information · Handling recommendations · PDF · en_US
LED 无铅回流焊的详细介绍 · Soldering and processing · PDF · en_US
Measuring of the temperature profile during the reflow solder process · Soldering and processing · PDF · en_US
Processing of SMD LEDs · Soldering and processing · PDF · en_US
Recommended pick-and-place tools of LEDs · Soldering and processing · PDF · en_US
PCB technologies for LED applications · Thermal management · PDF · en_US
Package related thermal resistance of LEDs · Thermal management · PDF · en_US
LED solder point temperature measurement with thermocouples · Thermal management · PDF · en_US
Thermal management of LED light sources · Thermal management · PDF · en_US
The thermal measurement point of LEDs · Thermal management · PDF · en_US
Comparison of simple LED circuits for low power LEDs · Electrical design · PDF · en_US
Dimming LEDs with respect to grouping current · Electrical design · PDF · en_US
The basic principles of Electrical Overstress (EOS) · Electrical design · PDF · en_US
LED diagnosis in automotive applications · Electrical design · PDF · en_US

リソース
CAD Data · CAD Data · FOLDER
Electrical Simulation · Electrical Simulation · FOLDER
Optical Simulation · Optical Simulation · FOLDER

画像
KW4 HPL631.TK · Images · TIF

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