ams AS585X_EVM Evaluation kit


The AS585x Evaluation Kit is a stand-alone system, supporting all devices of the AS585x family. It allows the complete device configuration, the measurement of all the relevant parameters (like noise and input linearity) and the connection to an X-ray photodetector panel.

Two different AS585x samples are included in the Evaluation Kit in order to perform the complete evaluation:
1. AS585x Chip-on-Board (COB) sample: The AS585x die is directly bonded to the AS585x sample board, which is equipped with the signal generator circuitry. Such circuitry allows the generation of the input signals that emulate the photodetector as in the real application.
2. AS585x Chip-on-Flex (COF) sample: The default package type of the AS585x, where the die is bonded on a flex substrate. Such package allows the direct connection to an X-ray photodetector panel.