OSRAM Advanced Power TOPLED™, LR G6SP.01

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品目

Latest version of Advanced Power TOPLED with increased brightness and improved thermal management.
データシート
LR G6SP.01 - Dual binning
英語
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中国語（簡体字）
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LR G6SP.01
英語
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中国語（簡体字）
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選択と注文
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詳細

パラメーター

発光色
Red (612-630 nm)
電力
0.31 W
Mid
輝度
ΦV 典型
17.3 lm
IV 典型
5.8 cd
ΦE 典型
98.6 mW
IE 典型
33.1 mW/sr
ビーム角
∢ 典型
120 °
動作温度
Top 最小
-40 °C
Top 最大
125 °C
寸法
l 典型
3.3 mm
w 典型
3.4 mm
h 典型
1.9 mm
Device qualification
AEC-Q102

注文情報

製品タイプ 品目 注文コード 在庫状況
LR G6SP.01-6D7E-46-G3R3 Iv = 5.0 ... 10.0 cd (IF = 140 mA) Q65112A5627 フル生産
LR G6SP.01-T2V1-1-A3D3-7D7E-46-G3R3 Iv = 355 ... 900 mcd (IF = 140 mA)
Iv = 5.6 ... 10.0 cd (IF = 10 mA) 		Q65113A3927 フル生産

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データシート
LR G6SP.01 - Dual binning · Datasheet · PDF · en_US
LR G6SP.01 · Datasheet · PDF · en_US

アプリケーションノート
Driving the Advanced Power TOPLED® · Product related · PDF · en_US
Customer complaint management — Details on return shipments for failure analysis request (FAR) · General information · PDF · en_US
Details on photobiological safety of LED light sources · General information · PDF · en_US
Preventing LED failures caused by corrosive materials · General information · PDF · en_US
Long-term availability management · General information · PDF · en_US
Importing rayfiles and ray-measurement files of LEDs · General information · PDF · en_US
Chemical compatibility of LEDs · General information · PDF · en_US
欧司朗光电半导体有限公司 LED 的测量、 · General information · PDF · en_US
Fundamentals of LED handling · Handling recommendations · PDF · en_US
ESD protection while handling LEDs · Handling recommendations · PDF · en_US
Handling of silicon resin LEDs · Handling recommendations · PDF · en_US
Dry pack information · Handling recommendations · PDF · en_US
LED 无铅回流焊的详细介绍 · Soldering and processing · PDF · en_US
Manual lead-free soldering of LEDs · Soldering and processing · PDF · en_US
Measuring of the temperature profile during the reflow solder process · Soldering and processing · PDF · en_US
Processing of SMD LEDs · Soldering and processing · PDF · en_US
Recommended pick-and-place tools of LEDs · Soldering and processing · PDF · en_US
PCB technologies for LED applications · Thermal management · PDF · en_US
Package related thermal resistance of LEDs · Thermal management · PDF · en_US
LED solder point temperature measurement with thermocouples · Thermal management · PDF · en_US
Thermal management of LED light sources · Thermal management · PDF · en_US
Comparison of simple LED circuits for low power LEDs · Electrical design · PDF · en_US
Dimming LEDs with respect to grouping current · Electrical design · PDF · en_US
LED driving technology for long term flexibility · Electrical design · PDF · en_US
The basic principles of Electrical Overstress (EOS) · Electrical design · PDF · en_US
LED diagnosis in automotive applications · Electrical design · PDF · en_US

リソース
CAD Data · CAD Data · FOLDER
Electrical Simulation · Electrical Simulation · FOLDER
Optical Simulation · Optical Simulation · FOLDER

画像
APT - InGaAlP_Productpicture · Images · TIF

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