OSRAM TOPLED™ E1608, KG DELMS1.22

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Ordering and shipping still possible

品目

The TOPLED E1608 expands ams OSRAM’ low power portfolio by offering one of the smallest LED Industry standard footprints in a highly reliable and well proven package concept. Its outstanding performance is suitable for a huge variety of applications especially automotive interior where a small package design with excellent reliability is needed. The TOPLED E1608 is available in different colors and brightness levels.
データシート
KG DELMS1.22
英語
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中国語（簡体字）
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選択と注文
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詳細

パラメーター

発光色
Green (565-575 nm)
電力
0.042 W
Low
輝度
ΦV 典型
0.268 lm
IV 典型
0.082 cd
ΦE 典型
0.419 mW
IE 典型
0.128 mW/sr
ビーム角
∢ 典型
120 °
動作温度
Top 最小
-40 °C
Top 最大
110 °C
寸法
l 典型
1.6 mm
w 典型
0.8 mm
h 典型
0.6 mm
Device qualification
AEC-Q102

注文情報

製品タイプ 品目 注文コード 在庫状況
KG DELMS1.22-PHQI-24-E6L6 Iv = 52 ... 112 mcd (IF = 20 mA) Q65112A4854 注文・発送は可能です

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データシート
KG DELMS1.22 · Datasheet · PDF · en_US

アプリケーションノート
TOPLED™ E1608 LEDs for automotive interior design · Product related · PDF · en_US
Customer complaint management — Details on return shipments for failure analysis request (FAR) · General information · PDF · en_US
Details on photobiological safety of LED light sources · General information · PDF · en_US
Preventing LED failures caused by corrosive materials · General information · PDF · en_US
Long-term availability management · General information · PDF · en_US
Importing rayfiles and ray-measurement files of LEDs · General information · PDF · en_US
Chemical compatibility of LEDs · General information · PDF · en_US
欧司朗光电半导体有限公司 LED 的测量、 · General information · PDF · en_US
Fundamentals of LED handling · Handling recommendations · PDF · en_US
ESD protection while handling LEDs · Handling recommendations · PDF · en_US
Handling of silicon resin LEDs · Handling recommendations · PDF · en_US
Dry pack information · Handling recommendations · PDF · en_US
LED 无铅回流焊的详细介绍 · Soldering and processing · PDF · en_US
Manual lead-free soldering of LEDs · Soldering and processing · PDF · en_US
Measuring of the temperature profile during the reflow solder process · Soldering and processing · PDF · en_US
Processing of SMD LEDs · Soldering and processing · PDF · en_US
Recommended pick-and-place tools of LEDs · Soldering and processing · PDF · en_US
PCB technologies for LED applications · Thermal management · PDF · en_US
Package related thermal resistance of LEDs · Thermal management · PDF · en_US
LED solder point temperature measurement with thermocouples · Thermal management · PDF · en_US
Thermal management of LED light sources · Thermal management · PDF · en_US
Comparison of simple LED circuits for low power LEDs · Electrical design · PDF · en_US
Determination of resistances for brightness compensation · Electrical design · PDF · en_US
Dimming LEDs with respect to grouping current · Electrical design · PDF · en_US
LED driving technology for long term flexibility · Electrical design · PDF · en_US
The basic principles of Electrical Overstress (EOS) · Electrical design · PDF · en_US

リソース
CAD Data · CAD Data · FOLDER
Electrical Simulation · Electrical Simulation · FOLDER
Optical Simulation · Optical Simulation · FOLDER

画像
TOPLED E1608 KO DELP71-22 · Images · TIF

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その他 TOPLED™ E1608

TOPLED™ E1608 expands ams OSRAMs low power portfolio.
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