OSRAM OSLON™ Black Flat X, KW HHL631.TK

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Not for new design

설명

The OSLON Black Flat X product family offers LED devices with the highest efficiency in the ams OSRAM portfolio. This feature makes it the perfect light source for standard forward lighting applications with a high focus on system cost. The SMT device is very stable, durable and can be used with standard processes. The pad geometry of the widely used OSLON Black Flat product platform was further optimized to allow for excellent thermal conditions, while the already known, outstanding contrast of the package concept is kept on the familiar level.
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KW HHL631.TK
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세부 정보

조건

Color of emission
White
Electrical power
3.2 W
High
Brightness
ΦV
498 lm
IV
161 cd
ΦE
1550 mW
IE
504 mW/sr
Beam angle
∢
120 °
Operating temperature
Top min.
-40 °C
Top max.
135 °C
Dimension
l
3.75 mm
w
3.75 mm
h
0.49 mm
Device qualification
AEC-Q102

주문 정보

제품 유형 설명 주문 코드 재고 여부
KW HHL631.TK-5SSA-4L05M0-2686 ΦV = 410 ... 560 lm (IF = 1000 mA) Q65113A1245 새로운 설계 계획 없음
KW HHL631.TK-5SSB-4L07M0-2686 ΦV = 410 ... 585 lm (IF = 1000 mA) Q65113A4583 새로운 설계 계획 없음
KW HHL631.TK-6SSB-6L07M0-2686 ΦV = 430 ... 585 lm (IF = 1000 mA) Q65113A1244 새로운 설계 계획 없음

다운로드

데이터시트
KW HHL631.TK · Datasheet · PDF · en_US

애플리케이션 노트
OSLON™ Black Flat X Family · Product related · PDF · en_US
Customer complaint management — Details on return shipments for failure analysis request (FAR) · General information · PDF · en_US
Details on photobiological safety of LED light sources · General information · PDF · en_US
Preventing LED failures caused by corrosive materials · General information · PDF · en_US
Importing rayfiles and ray-measurement files of LEDs · General information · PDF · en_US
Chemical compatibility of LEDs · General information · PDF · en_US
欧司朗光电半导体有限公司 LED 的测量、 · General information · PDF · en_US
Fundamentals of LED handling · Handling recommendations · PDF · en_US
ESD protection while handling LEDs · Handling recommendations · PDF · en_US
Handling of silicon resin LEDs · Handling recommendations · PDF · en_US
Dry pack information · Handling recommendations · PDF · en_US
LED 无铅回流焊的详细介绍 · Soldering and processing · PDF · en_US
Measuring of the temperature profile during the reflow solder process · Soldering and processing · PDF · en_US
Processing of SMD LEDs · Soldering and processing · PDF · en_US
Recommended pick-and-place tools of LEDs · Soldering and processing · PDF · en_US
PCB technologies for LED applications · Thermal management · PDF · en_US
Package related thermal resistance of LEDs · Thermal management · PDF · en_US
LED solder point temperature measurement with thermocouples · Thermal management · PDF · en_US
Thermal management of LED light sources · Thermal management · PDF · en_US
The thermal measurement point of LEDs · Thermal management · PDF · en_US
Comparison of simple LED circuits for low power LEDs · Electrical design · PDF · en_US
Dimming LEDs with respect to grouping current · Electrical design · PDF · en_US
The basic principles of Electrical Overstress (EOS) · Electrical design · PDF · en_US
LED diagnosis in automotive applications · Electrical design · PDF · en_US

자원
CAD Data · CAD Data · FOLDER
Electrical Simulation · Electrical Simulation · FOLDER
Optical Simulation · Optical Simulation · FOLDER

이미지
KW HHL631.TK · Images · TIF

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