OSRAM OSLON™ Black Flat S, KW HHL532.TK

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Beschreibung

The OSLON Black Flat S product family meets both, excellent brightness in combination with outstanding luminance. The SMT device is very stable, durable and can be used with standard SMT processes. A new solder pad layout allows for high reliability and supperior thermal management. The compact chips deliver high light output. The Device is Pin-compatible with LUW HWQP.

Details

Parameter

Color of emission
White
Electrical power
3.2 W
High
Brightness
ΦV
395 lm
IV
128 cd
ΦE
1260 mW
IE
408 mW/sr
Beam angle
120 °
Operating temperature
Top min.
-40 °C
Top max.
135 °C
Dimension
l
3.75 mm
w
3.75 mm
h
0.49 mm
Device qualification
AEC-Q102

Bestellinformation

Produkt-Typ Beschreibung Bestellnummer Verfügbarkeit
KW HHL532.TK-S2S8-4L07M0-2686 ΦV = 355 ... 510 lm (IF = 1000 mA) Q65112A8068 volle Produktion
KW HHL532.TK-S2S9-4L07M0-2686 ΦV = 355 ... 535 lm (IF = 1000 mA) Q65112A9389 volle Produktion

Downloads

Datenblätter

KW HHL532.TK · Datasheet · PDF · en_US

Anwendungshinweise

OSLON™ Black Flat S - Details on handling and assembly · Product related · PDF · en_US
Customer complaint management — Details on return shipments for failure analysis request (FAR) · General information · PDF · en_US
Details on photobiological safety of LED light sources · General information · PDF · en_US
Preventing LED failures caused by corrosive materials · General information · PDF · en_US
Importing rayfiles and ray-measurement files of LEDs · General information · PDF · en_US
Chemical compatibility of LEDs · General information · PDF · en_US
欧司朗光电半导体有限公司 LED 的测量、 · General information · PDF · en_US
Fundamentals of LED handling · Handling recommendations · PDF · en_US
ESD protection while handling LEDs · Handling recommendations · PDF · en_US
Handling of silicon resin LEDs · Handling recommendations · PDF · en_US
Dry pack information · Handling recommendations · PDF · en_US
Weitere Hinweise zum bleifrei Reflow-Löten von LEDs · Soldering and processing · PDF · en_US
Measuring of the temperature profile during the reflow solder process · Soldering and processing · PDF · en_US
Processing of SMD LEDs · Soldering and processing · PDF · en_US
Recommended pick-and-place tools of LEDs · Soldering and processing · PDF · en_US
PCB technologies for LED applications · Thermal management · PDF · en_US
Package related thermal resistance of LEDs · Thermal management · PDF · en_US
LED solder point temperature measurement with thermocouples · Thermal management · PDF · en_US
Thermal management of LED light sources · Thermal management · PDF · en_US
The thermal measurement point of LEDs · Thermal management · PDF · en_US
Comparison of simple LED circuits for low power LEDs · Electrical design · PDF · en_US
Dimming LEDs with respect to grouping current · Electrical design · PDF · en_US
The basic principles of Electrical Overstress (EOS) · Electrical design · PDF · en_US
LED diagnosis in automotive applications · Electrical design · PDF · en_US

Ressourcen

CAD Data · CAD Data · FOLDER
Electrical Simulation · Electrical Simulation · FOLDER
Optical Simulation · Optical Simulation · FOLDER

Bilder

OSLON Black Flat S 1-Chip · Images · TIF