OSRAM Advanced Power TOPLED™, LS G6SP.02

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Beschreibung

The Advanced Power TOPLED.02 (APT.02) features ams OSRAM’s state-of-the-art generation of PLCC 6 packages, which have set a market standard in the mid power LED world and were decades ago the first of its kind. With its very robust design, the APT.02 family can withstand harsh environmental conditions and offers the highest level of processability. Containing our latest InGaAlP-chip technology the APT.02 keeps its market leading brightness performance and offers a wide range of available bins with a high luminous efficiency and an excellent thermal resistance.
Datenblatt
LS G6SP.02
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Details

Eigenschaften

  • AEC-Q102 Qualified with RV-level 1
  • white SMT package, colorless clear silicone resin

Vorteile

  • High Automotive Quality
  • standardized package size

Parameter

Color of emission
Super Red (627-639 nm)
Electrical power
0.3 W
Mid
Brightness
ΦV
18.6 lm
IV
6.25 cd
ΦE
106 mW
IE
35.5 mW/sr
Beam angle
∢
120 °
Operating temperature
Top min.
-40 °C
Top max.
125 °C
Dimension
l
3.3 mm
w
3.4 mm
h
1.9 mm
Device qualification
AEC-Q102

Bestellinformation

Produkt-Typ Beschreibung Bestellnummer Verfügbarkeit
LS G6SP.02-5D7D-78-G3R3-140 Iv = 4.5 ... 6.3 cd (IF = 140 mA) Q65113A3567 volle Produktion
LS G6SP.02-6D5E-67-G3R3-140 Iv = 5.0 ... 8.0 cd (IF = 140 mA) Q65113A3565 volle Produktion

Downloads

Datenblätter
LS G6SP.02 · Datasheet · PDF · en_US

Anwendungshinweise
Driving the Advanced Power TOPLED® · Product related · PDF · en_US
Customer complaint management — Details on return shipments for failure analysis request (FAR) · General information · PDF · en_US
Details on photobiological safety of LED light sources · General information · PDF · en_US
Preventing LED failures caused by corrosive materials · General information · PDF · en_US
Long-term availability management · General information · PDF · en_US
Importing rayfiles and ray-measurement files of LEDs · General information · PDF · en_US
Chemical compatibility of LEDs · General information · PDF · en_US
欧司朗光电半导体有限公司 LED 的测量、 · General information · PDF · en_US
Fundamentals of LED handling · Handling recommendations · PDF · en_US
ESD protection while handling LEDs · Handling recommendations · PDF · en_US
Dry pack information · Handling recommendations · PDF · en_US
Weitere Hinweise zum bleifrei Reflow-Löten von LEDs · Soldering and processing · PDF · en_US
Manual lead-free soldering of LEDs · Soldering and processing · PDF · en_US
Measuring of the temperature profile during the reflow solder process · Soldering and processing · PDF · en_US
Processing of SMD LEDs · Soldering and processing · PDF · en_US
Recommended pick-and-place tools of LEDs · Soldering and processing · PDF · en_US
PCB technologies for LED applications · Thermal management · PDF · en_US
Package related thermal resistance of LEDs · Thermal management · PDF · en_US
LED solder point temperature measurement with thermocouples · Thermal management · PDF · en_US
Thermal management of LED light sources · Thermal management · PDF · en_US
Comparison of simple LED circuits for low power LEDs · Electrical design · PDF · en_US
Dimming LEDs with respect to grouping current · Electrical design · PDF · en_US
LED driving technology for long term flexibility · Electrical design · PDF · en_US
The basic principles of Electrical Overstress (EOS) · Electrical design · PDF · en_US
LED diagnosis in automotive applications · Electrical design · PDF · en_US

Ressourcen
CAD Data · CAD Data · FOLDER
Electrical Simulation · Electrical Simulation · FOLDER
Optical Simulation · Optical Simulation · FOLDER

Bilder
APT.02 product picture · Images · TIF

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