Details
Eigenschaften
- Line times down to 40 µs
- Binning mode (half the number of effective channels) for faster readout speed down to 20 µs
- Selectable parameters: input charge range, holes or electrons polarity, detector timing, low-pass filter time constant and line time
- Up to three different internal charge pump cycles for offset adjusting, signal emulation and switch charge injection compensation
- Two power modes in addition to sleep and full power-down modes
- Correlated Double Sampling for offset subtraction with programmable time constant
Vorteile
- Flexible programming options to optimize for application needs
- Suitable to a wide range of detector sizes, supporting line capacitances up to 200 pF
- Best-in-class figure of merit for noise, power consumption and speed
- High-speed for dynamic applications
- Ultra-low power for portable applications
- Low-noise for great image quality
- Accurate temperature feedback
- Chip-on-flex packaging suitable to ACF bonding on the detector side and to a low-cost standard connector on the PCB side
Parameter
Channels
input
256
Integration time
min.
40
µs
Input related noise
500
Power consumption per channel
min.
1.6
mW
Resolution
16
bit
Package
chip-on-flex (ACF bonding + standard connector)
Function
x-ray sensing
Downloads
Datenblätter
Short datasheet
Technische Dokumente
Factsheet
Umweltdokumente
RoHS certificate
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ams AS5852B 数字X射线平板读取IC
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