Details
Eigenschaften
- Unique module assembly concept of BSIP. No external components required.
- Three ASICs and passive components embedded in BSIP
- BSIP pixel size of 341 µm x 365 µm. Package customizable for pixel pitches of 340 µm and above
- Ease-of-use, no ASIC specific calibrations required
- Applicable for all electron collection type of direct conversion materials
- Adjustable number of thresholds for power optimization
- Adjustable integration time, maximum frame rate up to 9615 Fps
- Static leakage compensation of 250 nA and dynamic compensation of up to 700 nA in high range mode.
- On-chip voltage reference and temperature sensor
Vorteile
- 4-Side Buttable System-In-Package (BSIP) in 1728-channel 24.52 mm x 8.75 mm
- Paralyzable and non-paralyzable counting mode integrated and selectable via SPI
- 15-bit counting depth up to an input count rate of 250 Mcps per pixel (2 Gcps/mm²)
- Highest output count rate of 15 Mcps/pixel (120 Mcps/mm²) in paralyzable model and typ. 40 Mcps/pixel (320 Mcps/mm²) in non-paralyzable mode
- Ultra-low noise down to 330 electrons for an energy resolution of about 3.5 keV FWHM
- Lowest power dissipation with all 5 comparators down to typ. 0.64 mW/pixel in non-paralyzable mode and 0.58 mW/pixel in paralyzable mode
- Up to 5 selectable comparators with 8-bit adjustable thresholds for 0.7 keV/LSB
- Fast shaper pulse width of typ. 15 ns FWHM
- Configurable equivalent dead time for non-paralyzable mode
Parameter
Channels
input
1728
Integration time
min.
104
µs
Input related noise
330
Power consumption per channel
min.
0.58
mW
Resolution
16
bit
Package
4-Side Buttable System-In-Package (BSIP)
Function
x-ray sensing
Anwendungsfelder
Downloads
Datenblätter
Short datasheet
Bilder
Images
Images
Images
Images
Block diagram
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