OSRAM TOPLED™ E3014, KW DCLMS2.EC

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品目

The TOPLED Compact 3014 has a wide beam angle with a compact format (3.0 mm x 1.4 mm) and is one of the smallest LED for screen backlighting. It is therefore ideal for injecting in light guides for homogeneous illumination applications where the TOPLED Compact 3014 never fails to impress with its performance on system level.

詳細

パラメーター

発光色
White
CRI
80
電力
0.054 W
Low
輝度
ΦV 典型
11.3 lm
IV 典型
3.65 cd
ΦE 典型
36.4 mW
IE 典型
11.8 mW/sr
ビーム角
典型
120 °
動作温度
Top 最小
-40 °C
Top 最大
85 °C
寸法
l 典型
3.0 mm
w 典型
1.4 mm
h 典型
0.7 mm

注文情報

製品タイプ 品目 注文コード 在庫状況
KW DCLMS2.EC-CXCZ-4A7D-1 Iv = 2800 ... 4500 mcd, 8000 K (IF = 20 mA) Q65113A1686 フル生産
KW DCLMS2.EC-CXCZ-4H7I-1 Iv = 2800 ... 4500 mcd, 5000 K (IF = 20 mA) Q65113A1685 フル生産
KW DCLMS2.EC-CXCZ-4J7K-1 Iv = 2800 ... 4500 mcd, 4500 K (IF = 20 mA) Q65113A1684 フル生産
KW DCLMS2.EC-CXCZ-4L7M-1 Iv = 2800 ... 4500 mcd, 4000 K (IF = 20 mA) Q65113A1683 フル生産

ダウンロード

データシート

KW DCLMS2.EC · Datasheet · PDF · en_US

アプリケーションノート

Customer complaint management — Details on return shipments for failure analysis request (FAR) · General information · PDF · en_US
Details on photobiological safety of LED light sources · General information · PDF · en_US
Preventing LED failures caused by corrosive materials · General information · PDF · en_US
Long-term availability management · General information · PDF · en_US
Importing rayfiles and ray-measurement files of LEDs · General information · PDF · en_US
Chemical compatibility of LEDs · General information · PDF · en_US
欧司朗光电半导体有限公司 LED 的测量、 · General information · PDF · en_US
Fundamentals of LED handling · Handling recommendations · PDF · en_US
ESD protection while handling LEDs · Handling recommendations · PDF · en_US
Handling of silicon resin LEDs · Handling recommendations · PDF · en_US
Dry pack information · Handling recommendations · PDF · en_US
LED 无铅回流焊的详细介绍 · Soldering and processing · PDF · en_US
Manual lead-free soldering of LEDs · Soldering and processing · PDF · en_US
Measuring of the temperature profile during the reflow solder process · Soldering and processing · PDF · en_US
Processing of SMD LEDs · Soldering and processing · PDF · en_US
Recommended pick-and-place tools of LEDs · Soldering and processing · PDF · en_US
PCB technologies for LED applications · Thermal management · PDF · en_US
Package related thermal resistance of LEDs · Thermal management · PDF · en_US
LED solder point temperature measurement with thermocouples · Thermal management · PDF · en_US
Thermal management of LED light sources · Thermal management · PDF · en_US
Comparison of simple LED circuits for low power LEDs · Electrical design · PDF · en_US
Determination of resistances for brightness compensation · Electrical design · PDF · en_US
Dimming LEDs with respect to grouping current · Electrical design · PDF · en_US
LED driving technology for long term flexibility · Electrical design · PDF · en_US
The basic principles of Electrical Overstress (EOS) · Electrical design · PDF · en_US

リソース

CAD Data · CAD Data · FOLDER
Electrical Simulation · Electrical Simulation · FOLDER
Optical Simulation · Optical Simulation · FOLDER

画像

DURIS E3 - GW JCLPS1.xM · Images · JPG