SYNIOS® P2720
SYNIOS® P 2720 - Full performance and flexibility with just one footprint.
SYNIOS® P2720 is a very powerful and reliable product family that excels through its high brightness, low thermal resistance and thermal stability. Featuring different chip size classes and colors with one common footprint, the SYNIOS® P2720 family also shines with high flexibility and full scalability. Another great advantage of the SYNIOS® P2720 is its exceptional temperature cycle stability. The lead frame part is optimized for the thermal expansion coefficient of the circuit board, thus securing very stable soldered joints.
SYNIOS® P 2720 is a powerful and reliable product family that excels through its high brightness, low thermal resistance and thermal stability. Featuring different chip size classes and colors with one common footprint, the SYNIOS® P 2720 family also shines with high flexibility and full scalability. Another great advantage of the SYNIOS® P 2720 is its exceptional temperature cycle stability. The lead frame part is optimized for the thermal expansion coefficient of the circuit board, thus securing very stable soldered joints.
적용 분야
SYNIOS® P 2720 is a powerful and reliable product family that excels through its high brightness, low thermal resistance and thermal stability. Featuring different chip size classes and colors with one common footprint, the SYNIOS® P 2720 family also shines with high flexibility and full scalability. Another great advantage of the SYNIOS® P 2720 is its exceptional temperature cycle stability. The lead frame part is optimized for the thermal expansion coefficient of the circuit board, thus securing very stable soldered joints.
SYNIOS® P 2720 is a powerful and reliable product family that excels through its high brightness, low thermal resistance and thermal stability. Featuring different chip size classes and colors with one common footprint, the SYNIOS® P 2720 family also shines with high flexibility and full scalability. Another great advantage of the SYNIOS® P 2720 is its exceptional temperature cycle stability. The lead frame part is optimized for the thermal expansion coefficient of the circuit board, thus securing very stable soldered joints.