OSRAM OSLON™ Signal, LB CRBP.01

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Beschreibung

The OSLON™ Signal combines a compact form factor with high efficiency and electrically insulated thermal pad. The square package matches the optical center with the mechanical center. This provides easy clustering flexibility and high packing density for a maximum flux density. The color bins are defined for best fit to most signaling norms.
Datenblatt
LB CRBP.01
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Details

Parameter

Color of emission
Blue (450-480 nm)
Electrical power
1.0 W
High
Brightness
ΦV
50 lm
IV
15.3 cd
ΦE
1890 mW
IE
578 mW/sr
ΦP
0.187 µmol/s
Beam angle
∢
130 °
Operating temperature
Top min.
-40 °C
Top max.
125 °C
Dimension
l
3.0 mm
w
3.0 mm
h
2.12 mm

Bestellinformation

Produkt-Typ Beschreibung Bestellnummer Verfügbarkeit
LB CRBP.01-GXHY-26-Y474 ΦV = 18.0 ... 39.0 lm (IF = 350 mA) Q65113A2453 volle Produktion
LB CRBP.01-HYKX-7B-Y474 ΦV = 33.0 ... 82.0 lm (IF = 350 mA) Q65112A9298 volle Produktion

Downloads

Datenblätter
LB CRBP.01 · Datasheet · PDF · en_US

Anwendungshinweise
Customer complaint management — Details on return shipments for failure analysis request (FAR) · General information · PDF · en_US
Details on photobiological safety of LED light sources · General information · PDF · en_US
Importing rayfiles and ray-measurement files of LEDs · General information · PDF · en_US
Chemical compatibility of LEDs · General information · PDF · en_US
欧司朗光电半导体有限公司 LED 的测量、 · General information · PDF · en_US
Fundamentals of LED handling · Handling recommendations · PDF · en_US
ESD protection while handling LEDs · Handling recommendations · PDF · en_US
Handling of silicon resin LEDs · Handling recommendations · PDF · en_US
Dry pack information · Handling recommendations · PDF · en_US
Weitere Hinweise zum bleifrei Reflow-Löten von LEDs · Soldering and processing · PDF · en_US
Ceramic LEDs — Details on handling and processing · Soldering and processing · PDF · en_US
Measuring of the temperature profile during the reflow solder process · Soldering and processing · PDF · en_US
Processing of SMD LEDs · Soldering and processing · PDF · en_US
Recommended pick-and-place tools of LEDs · Soldering and processing · PDF · en_US
PCB technologies for LED applications · Thermal management · PDF · en_US
Package related thermal resistance of LEDs · Thermal management · PDF · en_US
LED solder point temperature measurement with thermocouples · Thermal management · PDF · en_US
Thermal management of LED light sources · Thermal management · PDF · en_US
Comparison of simple LED circuits for low power LEDs · Electrical design · PDF · en_US
Dimming LEDs with respect to grouping current · Electrical design · PDF · en_US
The basic principles of Electrical Overstress (EOS) · Electrical design · PDF · en_US
LED diagnosis in automotive applications · Electrical design · PDF · en_US

Ressourcen
CAD Data · CAD Data · FOLDER
Electrical Simulation · Electrical Simulation · FOLDER
Optical Simulation · Optical Simulation · FOLDER

Bilder
LB CRBP 01 · Images · TIF

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