OSRAM FIREFLY™ E1608, CN DELSS2.27

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설명

The FIREFLY E1608 family expands ams OSRAM’s portfolio of products for use in mobile devices like fitness tracker, TWS earbuds and smart watch, and for health monitoring. It offers one of the smallest LED footprints in a highly reliable and proven package. The compact size of only 0.8 mm x 1.6 mm x 0.6 mm provides customers the benefit of more flexible product designs. This IR device is the perfect choice for SpO2 measurements as well as for proximity sensing. Additionally, the product is ideally suited for integration into rain sensors and therefore features the automotive qualification AEC-Q102. Please check also our 940nm version as well as green and red Firefly E1608.
데이터시트
CN DELSS2.27
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세부 정보

조건

Color of emission
Infrared (>800 nm)
Current
IF
20 mA
Peak wavelength
λ
860 nm
Brightness
ΦE
13.4 mW
IE
3.9 mW/sr
Dimension
l
1.6 mm
w
0.8 mm
h
0.6 mm
Operating temperature
Top min.
-40 °C
Top max.
110 °C

주문 정보

제품 유형 설명 주문 코드 재고 여부
CN DELSS2.27 Ie = 3.20 ... 4.60 mW/sr, (Ie=3.7 mW/sr typ.) (IF = 20 mA) Q65115A1092 완전 가동 생산

다운로드

데이터시트
CN DELSS2.27 · Datasheet · PDF · en_US

애플리케이션 노트
Firefly™ E1608 and Firefly™ E2218 - Details on handling and processing · Product related · PDF · en_US
Health monitoring · Product related · PDF · en_US
Customer complaint management — Details on return shipments for failure analysis request (FAR) · General information · PDF · en_US
Details on photobiological safety of LED light sources · General information · PDF · en_US
Importing rayfiles and ray-measurement files of LEDs · General information · PDF · en_US
Chemical compatibility of LEDs · General information · PDF · en_US
欧司朗光电半导体有限公司 LED 的测量、 · General information · PDF · en_US
Fundamentals of LED handling · Handling recommendations · PDF · en_US
ESD protection while handling LEDs · Handling recommendations · PDF · en_US
Dry pack information · Handling recommendations · PDF · en_US
LED 无铅回流焊的详细介绍 · Soldering and processing · PDF · en_US
Manual lead-free soldering of LEDs · Soldering and processing · PDF · en_US
Measuring of the temperature profile during the reflow solder process · Soldering and processing · PDF · en_US
Processing of SMD LEDs · Soldering and processing · PDF · en_US
Recommended pick-and-place tools of LEDs · Soldering and processing · PDF · en_US
PCB technologies for LED applications · Thermal management · PDF · en_US
Package related thermal resistance of LEDs · Thermal management · PDF · en_US
LED solder point temperature measurement with thermocouples · Thermal management · PDF · en_US
Thermal management of LED light sources · Thermal management · PDF · en_US
Comparison of simple LED circuits for low power LEDs · Electrical design · PDF · en_US
Determination of resistances for brightness compensation · Electrical design · PDF · en_US
Dimming LEDs with respect to grouping current · Electrical design · PDF · en_US
The basic principles of Electrical Overstress (EOS) · Electrical design · PDF · en_US

자원
CAD Data · CAD Data · FOLDER
Electrical Simulation · Electrical Simulation · FOLDER
Optical Simulation · Optical Simulation · FOLDER

이미지
CN DELSS1.27 CN DELSS2.27 42x26mm cmyk · Images · TIF

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