National projects

This projects focuses on research, development and prototypical implementation of artificial intelligence methods for the optimization of dynamic production chains.

The goal of this project is to develop a new generation of low-cost, Pb-free quantum dot SWIR sensor prototype for various applications.

The project “green sensing” aims to develop and optimize a production process of photonic components with increased integrated functionality utilizing on-chip light sources.​​​​

The focus of this project is to work on next generation heteregenous integration.

This project focuses on the miniaturization of Laser diodes and related driver systems in order to acheive mobile and robust light sources for quantum computing applications.

The aim of this project is to develop co-designed intergrated electronic and photonic solutions.

This project focused on the design, setup, test and proof of the sterilization of air filter systems by means of UV-C LED irradiation.

In this project, silicon-based photonic technologies will be developed for concrete applications in the field of security solutions for open processor systems.

Realization of comprehensive platform which will enable future PIC-driven products. The project covers fabrication, optoelectronic co-integration with a mature photonic PDK and demonstrator development.

This project explores the technical conditions, relevant, test systems, data and complementary solutions to create the base for a standardization (German DIN) of UV-C LEDs operating in water disinfection systems

This project investigates the inactivation of SARS-CoV-2 by UV-C light and com-patibility for humans.

The objective of the project is to develop next generation intelligent bio and medical sensors. The enhanced sensor solution will improve the stability of the crucial measurement parameters and significantly lower the power consumption

The project aims to develop efficient cabin through digital networking of technologies and systems under the research for aerospace program.

The project aims to provide a tool kit to face the challenges of sensor fusion in product development at an early stage. This will help realize the competitive systems consisting of sensors, emitters and ICs for complex applications. 
Dieses Projekt wird aus Mitteln des Europäischen Fonds für regionale Entwicklung kofinanziert. 

This project is focused on the study on how silicon photodiodes are able to absorb SWIR two-photon pair.

This project will study on simulation workflow capable of simulating different phenomena involved in behavior of electronic systems.

In this project, a dedicated simulation method model for adhesive failure will be developed.​​

The aim of the project is to develop highly integrated, cost-effective, flexible particle sensors for consumer applications. The project includes investigation on feasibility of different measurement setup, implementation and validation of the sensor.

The goal of the project is to develop a novel, ultra-compact, energy-efficient camera matrix which enhances the color and depth of images in real time, as well as provide accurate depth information for a wide range of applications in the automotive industry. 

The objective of the project is to develop integrated circuits (IC’s) for signal processing which has applications in various fields. The developed IC’s will be characterized by the integration of different sensors and functionalities.

In this project, all competence is brought together for successful sensing and design of environmental noises and sounds. This opens innovation potential for inexpensieve and intelligent acoustic sensing and for the active design of an enhanced audio ambience. ASD is a follow-up of the successful K-project „Advanced Audio Processing – AAP“ from the 1st Call of COMET K-projects with an extended consortium and a new focus with regards to content.

In the Nanospec project seven European partners joined forces to develop an advanced upconverting system that significantly enhances solar cell efficiencies. Key developments were the upconverter material, the combination with a second luminescent material to enlarge the used spectral region, photonic structures for photon management and efficient solar cells.

Integrated computational material, process and prod

Development of an innovative process chain and production tools for the industrial fabrication of CMOS based 3D-integrated nanosensors on wafer-scale.

Excellent technologies for cognitive products and cognitive production systems. Pro2Future is a so called COMET Centre publicly funded by the Austrian Competence Centres Program COMET (Competence Centres for Excellent Technologies). Pro2Future's core is a highly ambitious program which was jointly established by industry and academia.

The integration of laser light sources in silicon nanophotonic chips is a strongly demanded feature for a wide range of applications. Apart from data and telecom, optical sensing represents a highly attractive field of application. Within this research project, the necessary steps to realize such an optically pumped laser light source on silicon nitride waveguides will be elaborated.

PHELICITI pursues the challenging task to co-integrate photonic and electronic subsystems on a single 3D-integrated chip. As a collaborative project it gathers academia, research centers and two industrial partners in the fieldof semiconductor manufacturing and telecommunications

Hochintegrierter Time of Flight Sensor

Im Rahmen von “ ToF Excellence” entwickelt ams einen hochintegrierten, ultraschnellen Time-of-Flight Sensor, der vorwiegend in mobilen Geräten für den Autofokus der Kamera eingesetzt wird. Der laserbasierte Autofokus IC entsteht unter Berücksichtigung eines neuen Halbleiter-Technologieknotens, was eine bessere Performance bei höherer Integrationsdichte der einzelnen Komponenten erlaubt. Dieser Sensor ermöglicht eine deutlich schnellere und zuverlässigere Autofokusierung  der Kamera, als gegenwärtig mittels herkömmlicher Technologien erreichbar ist. Dieses Projekt wird aus Mitteln des Europäischen Fonds für regionale Entwicklung kofinanziert. 

180/150nm Pilotlinie

The scope of this project is the high-resolution analysis of internal interfaces in multilayer materials for electronic devices via aberration corrected STEM combined with HR EELS and EDS. For this purpose, a variety of different approaches for both, data acquisition and data analysis, is consequently refined to provide reliable and reproducible datasets with high accuracy in spatial and energetic resolution as well as in terms of quantitative reliability. At the same time, TEM sample preparation methods are sufficiently enhanced and modified to provide specimens with adequate quality.