European projects

Development of novel, all-weather multi-sensor perception system supported by Artificial intelligence (AI) that enables automated travel in all visibility and weather conditions and takes the technology to SAE L4 – the first highly auto-mated driving level. For the first time, a high-resolution adaptive multi-sensor suite will be developed by a single project building on a novel Artificial Intelligence perception-processing scheme for low visibility conditions. The result will be a robust, fault-tolerant perception system functional in practically all lighting conditions. 

The aim of the project is the conceptual development and demonstration of a beyond classic silicon sensor with the highest possible signal-to-noise ratio. Optical proximity sensors for modern mobile devices (smartphones, watches, etc.) with the necessary time- and spectrally-resolved measurement technology will be developed, to achieve the metrological assurance of a display disturbance that cannot be perceived by the eye.

The objectives of the SPECTRE project are the development of novel interference filters with high-precision filter functions, an extended UV range and an on-chip diffuser for spectral sensors with a field of view of 180° and a maximum height of 0.7 mm. The reduced pixel / channel distance and the simplified package allow for an outstanding price-performance ratio. Furthermore, the world's first multi-zone spectral sensor is developed which enables an excellent automatic white balance even in scenes with mixed light sources, with different lighting conditions or with objects with a dominant color influence.

The Optical Sensors Excellence Program (OSEP) aims to develop advanced photodiodes (PDs) for measuring ambient light and three-dimensional (3D) object distance detection, such as through direct time-of-flight (dTOF) technology. These sensors find applications in Augmented Reality (AR) and Virtual Reality (VR). In addition to PD development, the OSEP project focuses on optimizing semiconductor manufacturing processes for PDs and integrated circuits. This optimization ensures that the required optoelectronic performance characteristics of the sensors are achieved. Innovative system integration concepts adapt the performance parameters to specific applications, resulting in significant cost reductions of approximately 25%.

The OLYMPOS project will focus on development of novel modular platform as well as the development of state-of-the art magnetic and inductive position sensors. This modular platform architecture will provide a flexible and scalable foundation for the creation of high-performance sensors. The new platform concept and the position sensors will be validated by three demonstrators - one magnetic sensor and two inductive sensors. By leveraging a modular approach, the project aims to streamline the integration process and expedite the development of complex automotive sensors. Through the utilization of cutting-edge technology and innovative design techniques, the project aims to enhance the functional safety, accuracy, and cost-effectiveness of position sensors. These advancements will contribute to the overall performance and reliability of position sensors in automotive applications. 

The project works on a digitized experimental pilot line (backend technology laboratory) for optoelectronic components, to enable a digital twin concept. Inline-capable systems and AI processes will be developed that can detect defects and clearly assign them to the characterized components. Two demonstrators with different types of defects will be set up, characterized and the digital information about the individual information will be used as a basis for building finite element models of the digital twin. Finally, the real twins are aged in accelerated reliability and endurance tests to correlate any failures that occur with the fully known component characteristics in terms of built-in faults and defects. 

The project aims for the integration of visible laser light into waveguides to enable a multi-color coherent light source and as a stretched target photonic integrated circuits (PICs). ams OSRAMs task is the development of the modified laser diode ("gain element") and its hetero-integration into SiNx waveguide matrix material. It requires miniaturization and the development of wafer-level processes for laser diodes.

QPIC - Quantum Photonic Integrated Components is a project within the program of the quantum Valley Lower Saxony to explore technologies for future quantum computing. It exploits ionic states of metal atoms in ion-traps to enable respective quantum states. The main challenge is the development of photonic components for quantum technologies: integrated waveguides, electro-optical modulators, semiconductor lasers for the blue and UV spectral range. The individual components have to meet very demanding, previously unattained specifications in terms of wavelength, linewidth and stability.

The objective of the project is to improve the current state-of-the art silicon nitride (SiN) photonics pilot line for applications in life science. The project aims to establish a validated CMOS compatible SiN technology platform in the visible range for complex density integrated photonics integrated circuits (PICs).

The project aims to revolutionize in-vivo 3D imaging technique for non-invasive optical biopsy by considering medical needs with early diagnosis. This project will drive the next generation of optical coherence tomography (OC) system and will transform the use of OCT into widespread adoption in point-of-care diagnostics.  

ATHENIS_3D provides the industry’s first 3D integration of advanced More than Moore devices and More Moore devices (90nm and 14nm CMOS) with Through Silicon Vias (TSV) and Wafer Level Packaging (WLP) for harshest automotive conditions including temperatures up to 200C and voltages up to 200V. Cost savings from integration and a 5x reduction of PCB area will be shown.

This project brings together key partners with proven track-records to enhance the current state-of-the art system level image capture for diverse applications such as medical diagnostics and sustainable agriculture. The consortium will design new image sensors as well as focus on new silicon and system level developments.

The goal of this project is to develop fully disposable low cost electronic lateral flow system consisting of the strip and the electronic reading device. This type of solution could will bring the COVID-19 testing from laboratory application to the Point of Need.

This project aims to develop a reusable reader which is equipped with sensor and LED for reflective measurements. This new electronic rapid test can support health authorities at national and EU level in monitoring and mitigating the ongoing COVID-19 pandemic.

The EU funded Eniac project will design and develop Lithium-battery-pack systems which manage photovoltaic power feed efficiently and deliver optimized, reliable, low-cost and predictable performance. The BattMan project therefore focuses on essential elements and targets solar-powered, off-grid street lighting poles as a challenging demonstrator. It will be specified, simulated, designed, prototyped, demonstrated and validated in the project.

The aim of this project is to develop a capsule endoscope, which significantly reduces the amount of data generated by motion-controlled image acquisition. This means, on the one hand, an accelerated evaluation of the examination by the doctor, while at the same time, due to the saved data volume, allows the use of a high-resolution camera for better diagnosis and the storage of the image data in the capsule for easier handling.

The objective of this work is to develop a novel computer-aided design methodology for fast modeling and simulation of destructive substrate coupling effects in integrated mixed-signal, High Voltage (HV) and High Temperature (HT) smart power ICs for automotive applications.

The ENIAC JU project EPP combined research, development and innovation to demonstrate market readiness by industrial implementation at an early stage. Work to be performed included developing next generation power semiconductors based on 300mm wafers, setting up the required technologies as pilot line manufacturing, and demonstrating the thus achieved reliable and advantageous solutions for a wide range of ENIAC grand challenge application fields.

The ESTRELIA platform will enable a significant advancement of the technology capabilities for battery management systems design. A focused approach on battery management systems on the one hand but also cost effective system integration into vehicles on the other hand.

The mission of the MATTHEW project is to enable new applications and services on mobile devices. It will overcome the limitation of current passive NFC transmission technologies by active modulation and offer new ways of exchanging roles from one secure entity like a nanoSIM or a microSDTM card to another with novel security and privacy approaches.

PLASMOfab aims to develop CMOS compatible plasmonics in a generic planar integration process as the means to consolidate photonic and electronic integration. Wafer scale integration will be used by PLASMOfab to demonstrate low cost, volume manufacturing and high yield of powerful PICs. The new integration technology will unravel a series of innovations with profound benefits of enhanced light-matter interaction enabled by plasmonics in optical transmitters and biosensors modules.

MIRAGE aims to implement cost-optimized components for terabit optical interconnects introducing new multiplexing concepts through the development of a flexible, future-proof 3D “optical engine”. MIRAGE is a 3-year collaborative project on photonic integration that brings together eight leading European universities, research centers and companies. The project was launched in October 2012 and is co-funded by the European Commission through the Seventh Framework Programme (FP 7).