Find out more about running and closed European projects.
This collaborative project brings together European electronics packaging industry leaders from different value chains. The objective of the project is to build capacity in advanced packaging and assembly to develop novel tools and processes for high volume mass manufacturing of electrical & optical components.
The project will illuminate crucial digitalization aspects in underground mining operations to ensure proper safety, environment and economic performance. It will help develop a robust Industrial Internet of Things (IIoT) platform; which includes cloud computing and distributed cloud management; that connects using wireless communication with the physical mining world.
This project brings together a consortium of 79 European partners from 14 different countries. ams will bring its expertise, knowledge on sensor system development and integration specifically for automotive application into this project. ams will target to develop enhanced reliability models and methods to ensure advanced VCSEL based solutions.
The aim of the project is to move towards smart and secure energy solutiosn for future mobility and green energy transition. It is build on six use cases representing various aspects of mobility and energy.
The project is focused on the development of novel, all-weather multi-sensor perception system supported by Artificial intelligence (AI) that enables automated travel in all visibility and weather conditions and takes the technology to SAE L4 – the first highly auto-mated driving level.
The core of MANTIS vision is the development of a multi-modal, multi µ-camera system connected to an artificial intelligence (AI) capable edge processing box.
The objective of the project is to improve the current state-of-the art silicon nitride (SiN) photonics pilot line for applications in life science. The project aims to establish a validated CMOS compatible SiN technology platform in the visible range for complex density integrated photonics integrated circuits (PICs).
This project will help train researchers to face the future design challenges and opportunities in modern optics technology. The gained knowledge from the project will be used in industry to expand their expertise and business. It aims to open new door for nano-photonics, micro-optics and system-engineering research.
The project aims to revolutionize in-vivo 3D imaging technique for non-invasive optical biopsy by considering medical needs with early diagnosis. This project will drive the next generation of optical coherence tomography (OC) system and will transform the use of OCT into widespread adoption in point-of-care diagnostics.
ATHENIS_3D provides the industry’s first 3D integration of advanced More than Moore devices and More Moore devices (90nm and 14nm CMOS) with Through Silicon Vias (TSV) and Wafer Level Packaging (WLP) for harshest automotive conditions including temperatures up to 200C and voltages up to 200V. Cost savings from integration and a 5x reduction of PCB area will be shown.
The project will develop a distributed platform for autonomous farming by allowing the integration of agriculture cyber physical systems. It will ensure improved efficiency of animal health, food quality as well as reduce the farm labor costs. It will enable evidence based decision-making solutions supported by big data & real time data mining techniques.
E2SWITCH focuses on Tunnel FET (TFETs) as most promising energy efficient device candidates able to reduce the voltage supply of integrated circuits (ICs) below 0.25V and make them significantly more energy efficient by exploiting strained SiGe/Ge and III-V platforms, with CMOS technological compatibility.
This project brings together key partners with proven track-records to enhance the current state-of-the art system level image capture for diverse applications such as medical diagnostics and sustainable agriculture. The consortium will design new image sensors as well as focus on new silicon and system level developments.
The goal of this project is to develop fully disposable low cost electronic lateral flow system consisting of the strip and the electronic reading device. This type of solution could will bring the COVID-19 testing from laboratory application to the Point of Need.
This project aims to develop a reusable reader which is equipped with sensor and LED for reflective measurements. This new electronic rapid test can support health authorities at national and EU level in monitoring and mitigating the ongoing COVID-19 pandemic.
The EU funded Eniac project will design and develop Lithium-battery-pack systems which manage photovoltaic power feed efficiently and deliver optimized, reliable, low-cost and predictable performance. The BattMan project therefore focuses on essential elements and targets solar-powered, off-grid street lighting poles as a challenging demonstrator. It will be specified, simulated, designed, prototyped, demonstrated and validated in the project.
The aim of this project is to develop a capsule endoscope, which significantly reduces the amount of data generated by motion-controlled image acquisition. This means, on the one hand, an accelerated evaluation of the examination by the doctor, while at the same time, due to the saved data volume, allows the use of a high-resolution camera for better diagnosis and the storage of the image data in the capsule for easier handling.
ESEE – Environment Sensors for Energy Efficiency targets the markets, where highly reliable information regarding environmental conditions measurements can be deducted, which safe the use of energy. The ENIAC JU project ESEE developed wireless sensor networks for smart management of the air conditioning systems in offices and other public buildings, in homes, and in specific closed environments such as an aircraft cabin, demonstrating significant energy savings and applicability to other systems in which the energy consumption depends upon human presence like heating or lighting.
“Eyes of Things” is an international project focused on building an open embedded computer vision platform. EoT is an Innovation Action funded under the European Union’s H2020 Framework Programme. Our objective in this project is to build a power-size-cost-programmabilty optimized core vision platform that can work independently and also be embedded into all types of artefacts.
The objective of this work is to develop a novel computer-aided design methodology for fast modeling and simulation of destructive substrate coupling effects in integrated mixed-signal, High Voltage (HV) and High Temperature (HT) smart power ICs for automotive applications.
European research projects for energy efficiency, “eRamp” focused on the rapid introduction of new production technologies, such as packaging technologies for energy-saving chips. The eRamp project covered the entire power electronics value chain, from generation and transmission all the way to consumption.
The L3MATRIX project provides novel technological innovations in the fields of silicon photonics (SiP) and 3D device integration. The project will develop a novel SiP matrix with a scale larger than any similar device with more than 100 modulators on a single chip and will integrate embedded laser sources with a logic chip thus breaking the limitations on the bandwidth-distance product.
The ENIAC JU project EPP combined research, development and innovation to demonstrate market readiness by industrial implementation at an early stage. Work to be performed included developing next generation power semiconductors based on 300mm wafers, setting up the required technologies as pilot line manufacturing, and demonstrating the thus achieved reliable and advantageous solutions for a wide range of ENIAC grand challenge application fields.
The ADMONT – “Advanced Distributed Pilot Line for More-than-Moore Technologies” project is focused on a powerful and versatile More-than-Moore (MtM) pilot line for Europe increasing the diversification of CMOS process technologies. The distributed pilot line utilizes various MtM platform technologies for sensor and OLED processing in combination with baseline CMOS processes in a unique way and incorporates 2.5D as well as 3D integration of silicon systems into one single production flow.
The ESTRELIA platform will enable a significant advancement of the technology capabilities for battery management systems design. A focused approach on battery management systems on the one hand but also cost effective system integration into vehicles on the other hand.
The CATRENE MASTER_3D project will contribute to the transformation of European Union leadership in the R&D of 3D integrated circuits (ICs) into 3D IC manufacturing leadership. Manufacturing methods to maximise process robustness and yield, minimise ramp-up time, support high volume production and reduce manufacturing cost will be developed and implemented in consortium members’ fabs.
Aim of IoSense is to boost the European competitiveness of ECS industries by increasing the pilot production capacity and improving Time-to-Market for innovative microelectronics, accomplished by establishing three fully connected semiconductor pilot lines in Europe: two 200mm frontend (Dresden, Regensburg) and one backend (Regensburg) line networking with existing highly specialized manufacturing lines.
The MSP project - Multi Sensor Platform for Smart Building Management - is focused on the development of highly innovative components and sensors based on Key Enabling Technologies (KETs). The MSP-project employs Through-Silicon-Via (TSV) technology for 3D-integration of these devices on CMOS electronic platform chips to innovative smart systems capable for indoor and outdoor environmental monitoring.
The mission of the MATTHEW project is to enable new applications and services on mobile devices. It will overcome the limitation of current passive NFC transmission technologies by active modulation and offer new ways of exchanging roles from one secure entity like a nanoSIM or a microSDTM card to another with novel security and privacy approaches.
The Nanonest2Sense project aims at developing a low cost technology that could provide affordable devices for point-of-care detection of molecules of interest for health monitoring or pre-diagnostics. The Project has the objective to develop a new technological approach for the 3D CMOS integration of label-free sensors for medical applications.
PLASMOfab aims to develop CMOS compatible plasmonics in a generic planar integration process as the means to consolidate photonic and electronic integration. Wafer scale integration will be used by PLASMOfab to demonstrate low cost, volume manufacturing and high yield of powerful PICs. The new integration technology will unravel a series of innovations with profound benefits of enhanced light-matter interaction enabled by plasmonics in optical transmitters and biosensors modules.
MIRAGE aims to implement cost-optimized components for terabit optical interconnects introducing new multiplexing concepts through the development of a flexible, future-proof 3D “optical engine”. MIRAGE is a 3-year collaborative project on photonic integration that brings together eight leading European universities, research centers and companies. The project was launched in October 2012 and is co-funded by the European Commission through the Seventh Framework Programme (FP 7).
The research project PhoxTroT completed its activities successfully delivering revolutionary optical interconnect solutions towards High-Performance, Low-Cost & Low-Energy Data Centers, High Performance Computing Systems exploiting existing photonic technologies in a holistic way, synergizing the different fabrication platforms in order to deploy the optimal “mix&match” technology and tailoring this to each interconnect layer.
STREAM, Smart Sensor Technologies and Training for Radiation Enhanced Applications and Measurements, is an Innovative Training Network
(ITN). STREAM is a career development network on scientific design, construction and manufacturing of advanced radiation instrumentation. It targets the development of innovative radiation-hard, smart CMOS sensor technologies for scientific and industrial applications.