The vision for in-plane display sensing enabled by microLEDs is a simpler system architecture with enhanced sensor functionality, lower power, and lower sensor costs.
There are still essential technical development steps to be made before this vision becomes real and in-plane display sensing is available in the first products. When sensing is integrated in-plane within the display, the optical signal chain requires a complex set of interfaces that provide connections between the RGB and NIR micro-emitters, their microIC pixel-drivers, the microPDs and their read-out circuit, signal processing circuitry, other display elements, and the device’s SoC (see Figure 3).
ams OSRAM is working to address the challenge that in-plane sensing brings by working together with technology suppliers, display manufacturers, display driver and system-on-chip (SoC) manufacturers, OEMs, customers and other stakeholders. ams OSRAM is developing the alliances, standards and specifications required to pull together the complex new supply chain that can bring in-plane sensing to the market.