At ams OSRAM we go beyond the fundamental supply of silicon fabrication services and are ready to engage with your engineers on their next design. We help quicken your time to market, supporting your design with an extensive IP catalogue and high accuracy simulation models reducing cost.
At ams OSRAM we also support shared design developments and full turn-key solutions where our teams take full responsibility from device specification to release to volume production, including all design activities.
Beyond silicon is taken to the next level with advanced packaging solutions like TSV (through silicon vias) technology which can be implemented electrically and optically enabling more complex and dense structures in CMOS and Photonic IC design. Another example is our stitching technology which allows merging multiple reticles on a wafer during the photolithographic process.
A comprehensive list of design partners, MPW, testing facilities, post wafer production processing (sawing, sorting, packaging and more) round of our offering as full service foundry delivering More than Silicon.
Please ask our team to get a full list of More than Silicon technologies and services we offer!