Micro SIDELED®
Flat side-emitting device ideal for compact assembly
Details
Features
- ►Micro SIDELED® 2808
- Package: white SMT package, colored diffused silicone resin
- Chip technology: InGaN on Sapphire
- Typ. Radiation: 120° (Lambertian emitter)
- Color: Cx = 0.30, Cy = 0.28 acc. to CIE 1931 (white)
- Corrosion Robustness Class: 1B
- ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
- ►Micro SIDELED® 3010
- Package: white SMT package, colored diffused resin
- Chip technology: ThinGaN
- Typ. Radiation: 120° (Lambertian emitter)
- Color: Cx = 0.31, Cy = 0.29 acc. to CIE 1931 (● white)
- Corrosion Robustness Class: 2B
- ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
- ►Micro SIDELED® 3806 White and RGB
- Package: white SMT package, colored diffused silicone resin
- Chip technology: InGaN on Sapphire
- Typ. Radiation: 120° (Lambertian emitter)
- Color: Cx = 0.3050, Cy = 0.3026 acc. to CIE 1931 (● ultra white) — Optical efficacy: 180 lm/W
- Corrosion Robustness Class: 1B
- ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
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