Technology 

Our foundry offers high-performance analog and mixed-signal semiconductor manufacturing capabilities for automotive, medical, industrial and consumer applications.

Chip-packaging technologies developed by ams OSRAM help our state-of-the-art optical devices and sensor products to achieve extreme high precision, low noise performance and reduced system costs. 

Advanced packaging technologies from ams OSRAM include:
 

• Wafer-level optics, which enable the precise fabrication of lenses for miniature light sources and detectors 

• Through-silicon vias, which radically reduce the height of an optical IC package and eliminate the need for wire bonds 

• System-in-package (SiP) technology – ams OSRAM integrates complete sensor assemblies into a single SiP to save space and eliminate a board assembly process for customers 

• Stacked dual die – wherever reliability is a must, ams OSRAM offers fully redundant solutions with two of the same sensor dies in a single IC package. 

Capacitive sensing is a widely used technology in human presence detection, fluid-level sensing or hands on detection for autonomous driving. It works on the principle of capacitance: charge accumulates in the gap between two sheets of metal, or ‘electrodes’, when a voltage is applied to one electrode. The amount of charge which accumulates depends on a property, the ‘permittivity’, of the material between the electrodes.

At the heart of the capacitive sensor measurement system is a type of capacitive sensing technology called I/Q demodulation. This method measures the resistive as well as the capacitive element of a system’s impedance. The effect of this is that, unlike other methods for capacitive sensing, it works reliably even in difficult conditions, and is sensitive to small changes in resistance.

By shining light on or through objects and by looking at the reflected or transmitted spectrum, a sensor system can detect or classify what it is looking at.

Advantages of ams OSRAM spectral sensing technology:

• Interference filter technology for durability and spectral stability over time and temperature
• In-house filter manufacturing and testing capability
• In-house module design and manufacturing capability including
  • Detectors
  • Light source
  • Light path
  • Optics

ams OSRAM leads in visible and infrared edge-emitting lasers (EEL) technology for sensing, visualization and material processing.  

Edge-emitting lasers use nanostack technology (e.g.: triple-junction: three light-emitting surfaces (pn-junction) stacked one on top of the other), which has the main advantage of delivering high power within a small area (small size), making it the technology of choice for long-range LiDAR, visualization, illumination and material processing.  

Infrared laser diodes for sensing (LiDAR applications) with wavelength of 905nm have the highest efficiency on the market. The laser diodes can operate with extreme short pulses (down to 2nsec), while delivering outstanding power.  

Visible InGaN laser diodes for laser projection and illumination have a great optical output power at high operating temperature range. Single-mode laser diodes can operate at a higher temperature range without active cooling and have excellent efficiency, which can extend long life.  

High power performance with multi-mode laser diodes are the best fit for industry and automotive applications.  

> Explore our laser competence