Details
Features
- Small footprint and low profile package (3.10 x 2.05 x 1.00 mm)
- 0.18μm process technology with 1.8V I²C bus
Benefits
- Reduced board space requirements and enables low profile system design
- Reduced power consumption
Application fields
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Datasheets
Datasheet
Application note
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Environmental documents
Material declaration form
Material declaration form
RoHS certificate
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